Key Technologies and Trends: Reshaping the Future of Packaging in Latin America
In Latin America, CPGs, retail chains, packaging manufacturers, packaging materials suppliers, OEMs--and the different actors of this value chain--recognize the pivotal role that packaging innovation plays to position their products and captivate consumers. Up until now, there is no Latin American world-class forum exclusively on this topic, and innovation is the drive that moves our industry forward.
This international forum, presented by Mundo EXPO PACK, will gather top-notch global knowledge leaders as speakers to generate sound conversations and networking by exploring the present and future of packaging in Latin America. This forum will be THE platform to learn about the state-of-the-art technologies for packaging innovation.
Join us next October in Guadalajara and be part of the conversation with the most qualified influencers/voices in packaging Innovation in the world.
What makes PACKEvolution Latinoamérica 2024 different?
- Pushing forward innovation in materials and design
- Focused on finding solutions, not just more talk
- Programmed by the editors of Mundo EXPO PACK, the most trusted industry resource for Latin America
- The backing of PMMI, the largest association of packaging machinery manufacturers
Topics we will cover include:
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Innovative packaging and processing technologies and machinery
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Packaging sustainability
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Industry 4.0, including robotics, AI, digital twins, cybersecurity and AR/VR
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E-commerce innovations
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Intelligent and active packaging
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State-of-the-art packaging materials
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Disruptive packaging design trends
Past Speakers

Gerente de Desarrollo de Empaque - Nuestras Marcas
Walmart México y Centroamérica

Director General
IMPEE Instituto Mexicano de Profesionales en Envase y Embalaje

Co directora Hub Latam Int EPD System y Fundadora CADIS
Centro de Análisis de Ciclo de Vida y Diseño Sustentable S.A. de C.V.

Co directora Hub Latam Int EPD System y Fundadora CADIS
Especialista en automatización, robótica e Industria 4.0
Supported by:
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